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eNews Issue 58 - Articles |
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| Building Fewer Physical Prototypes |
When using software tools to analyse and replace diseased bone or predicting friction and flow around a swimsuit in the pursuit of speed, engineers are working with the complex behaviour of matter, where one set of variables depends directly on another.
The key to such calculations is to solve the partial differential equations that describe the situations and the way they react in their environment.
Until now, the finite element method has been used to solve these equations. Now a new method is creating a computational environment where the equations for any physical phenomena can be accessed and fully coupled without limitation, and applied to the geometry of the system's components.
Called multiphysics simulation, this makes it possible to run more 'what-if' analyses while building fewer physical prototypes. This ability to solve the fully coupled set of equations in a single, fast simulation is the real breakthrough.
Tim Morris, chief executive of independent FEA industry body NAFEMS, said: 'We are witnessing a surge of interest in multiphysics modelling within our membership — it has become one of the hot topics.'
Airbus, for example, used the Multiphysics program from Comsol, the computer solutions expert, to simulate friction stir welding (FSW). In this process, a cylindrical tool made up of a shoulder and a threaded pin is spun and inserted into the joint between two pieces of metal. The rotating shoulder and pin generate heat, but not enough to melt the metal.
Instead, the softened, plasticised metal forms a solid phase made up of a fine-grained material with no entrapped oxides or gas porosity. The crushing, stirring and forging action produces a joint with a finer microstructure than the parent material and with twice the strength. The process can even join dissimilar aluminum alloys.
Airbus funded several investigations into the study of FSW. 'One of the first results was a research project that created a mathematical model, allowing Airbus engineers to look "inside" a weld to examine temperature distributions and changes in microstructures,' said Paul Colegrove, a lecturer in welding engineering at Cranfield University.
Comsol's Multiphysics model couples a 3D thermal analysis for calculating heat flow with a 2D axisymmetric swirl flow simulation. This coupling, in turn, allows both the flow and heat generation to be calculated.
The thermal analysis calculates the 3D temperature field from the heat flux imposed at the tool surface. It captures the effect of the tool movement, the thermal boundary conditions and the thermal properties of the material being welded. The model then projects the temperature distribution near the tool surface from the 3D boundary to the domain in the 2D model.
US researchers at Medrad Innovations Group, led by John Kalafut, used multiphysics modelling to investigate the injection of non-Newtonian fluids (in which viscosity changes with the applied strain strain, such as non-drip paint or blood) with high shear-rates through thin syringes.
This work produced a particularly novel device called the Medrad Vanguard Dx Angiographic Catheter. The diffusion tip's nozzle design allows for a more uniform distribution of injected contrast materials (fluids that enhance the visibility of bodily objects during medical imaging) compared with a traditional end-hole catheter.
One problem with traditional end-hole catheters is that they tend to cause the contrast material to stream from the exit hole at high velocities, potentially endangering blood vessel walls. The Vanguard catheter reduces the reaction forces associated with contrast material streaming from the nozzle and therefore minimises the likelihood of contact and damage to the blood vessel walls.
A crucial feature of the catheter was the ideal configuration of holes or slits around the tip to optimise fluid delivery while preventing structural deflection. Kalafut's team used Comsol Multiphysics to couple forces from laminar flow with a stress-strain analysis, then modelled the fluid-structure interaction occurring in the catheters with various hole configurations, geometries and flow patterns.
Altair has also been making strides in biomedical engineering — the Shiley Centre for Orthopaedic Research and Education (SCORE) at Scripps Clinic in La Jolla, California, is using Altair HyperWorks software tools to analyse shoulder implants.
'We take the surface of the bone as the equivalent of CAD geometry,' said Dr Darryl D'Lima, director of SCORE's orthopaedic research laboratory. 'Then we create a solid mesh using HyperMesh and send it back to the CT scan software Mimics. Based on the scan, Mimics assigns material properties on an element-by-element basis and exports the file back to HyperMesh. We then have a high-fidelity surface with material properties that is unique to the patient.'
Using HyperMesh, the team can remove the diseased bone from the model of the patient's shoulder and replace it with an implant, including the cement that fixes it in position. 'As far as I know,' said D'Lima, 'HyperMesh is the only program that allows us to mesh complex organic bone surfaces and the CAD surfaces of the implant. HyperMesh does all the pre- and post-processing. It's the glue between Mimics and our stress-analysis solver.'
Similar techniques were used by Speedo to design its LZR Racer swimsuit. The location of various panels of a special 'slippery' material was decided on by using ANSYS Fluent CFD software. The software's predictions of friction and flow around the swimmer helped Speedo identify 'drag hot spots' that could benefit from the panels of the new material.
Speedo's CFD work and physical testing focused on passive drag — the drag produced by a swimmer's body while it is held in a streamlined position, which the swimmer typically assumes for up to 15m after the initial dive or turn.
This work is important, and there are opportunities to do even more with CFD in the future to analyse a swimmer throughout a race. Jim Cashman, ANSYS president and chief executive, said the success of examining passive drag sets the stage for more complex multiphysics simulations as the swimsuits continue to evolve. 'For example, we could look at the hydrodynamic pressure on the swimmer's body moving through the water in conjunction with the structural aspects of the suit,' he said.
Similar technology helped students at Sussex County Technical School in Sparta, New Jersey, win first prize for innovation and third place in best overall performance among the 26 human-powered submarines at the 9th International Submarine Races.
Sussex used the CFdesign software from Blue Ridge Numerics to optimise the overall configuration of its hull shape and propeller; the school needed a tool that would assess fluid flow early in the design process, so changes could be made quickly. 'We were able to use CFdesign to do iterations that helped us determine the amount of twist needed in the propeller blade and reduce overall drag,' said instructor and project manager Chris Land. 'Using CFdesign gave us a lot more confidence, especially since we didn't have the luxury of testing with physical prototypes.'
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| ANSYS and Ansoft Receive Early Termination of Hart-Scott-Rodino Act Waiting Period for Proposed Merger |
SOUTHPOINTE, Pa., May 2, 2008 (PRIME NEWSWIRE) -- ANSYS, Inc. (Nasdaq:ANSS) today announced that the U.S. Department of Justice and Federal Trade Commission have granted early termination of the Hart-Scott-Rodino (HSR) waiting period for ANSYS' proposed acquisition of Ansoft Corporation (Nasdaq:ANST). ANSYS currently expects to close the acquisition in the second quarter of 2008.
As previously announced, ANSYS and Ansoft have entered into a definitive merger agreement in which ANSYS will acquire Ansoft for a purchase price of approximately $832 million in a mix of cash and ANSYS common stock. Consummation of the transaction remains subject to customary closing conditions, including the approval of the Ansoft stockholders.
"We are very pleased that we have received notice of early termination and look forward to closing the transaction and implementing our plan," said Jim Cashman, president and CEO of ANSYS, Inc. "The combination of ANSYS and Ansoft will create substantial benefits for our global customers, employees, partners and stockholders, through continued investment and development of innovative products and services, and our commitment to world-class execution."
"The ANSYS portfolio of engineering simulation technologies, when combined with Ansoft, will enhance our ability to deliver integration, functionality and interoperability to a broad set of customers and industries," said Nicholas Csendes, president and chief executive officer of Ansoft.
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| Unexpected twist on medical care
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If you're a fan of German engineering in your car, chances are you'll love it in your brain scan.
Local hospitals are trying to cross-pollinate health care with technologies that have roots in the automotive and aerospace industries. The hope is that, with a medical twist, high-tech navigation systems, pattern recognition software and top-of-the-line robots can revolutionize the treatment of everything from irregular heartbeats to lung cancer.
St. Luke's Episcopal Hospital says it is the first in the world to treat stroke patients with the help of a robotic arm that has its origins in systems created by Munich-based Siemens AG for precision welding on the assembly lines of BMW and Mercedes-Benz.
The medical robot, dubbed Artis zeego and manufactured by Siemens Medical Solutions, is coupled with a CT scanner and X-ray. It can tilt, turn and spin at virtually infinite angles, capturing detailed images that track blood flow.
Imaging is usually limited, requiring a lot of time and guesswork to get the right picture so doctors can tell what's going on inside an artery. But this robot is made with a memory for pinpointing locations, allowing it to snap back almost instantly to an exact spot should the doctor need to take a second look.
Tracing a tiny bubble deep in the brain only a few millimeters long is an arduous business. In some cases mere seconds matter and older equipment becomes a time-drag, says Dr. Michel Mawad, the director of Neurovascular Radiology at St. Luke's who is testing out the Artis zeego. Mawad is also a member of Siemens' medical advisory board.
''This takes the human error out. You can reproduce the exact angle every time," he says. ''We're being very careful. We're going very slow for now, but there's tremendous potential for speed here."
Helps in difficult cases
St. Luke's Vice President Mike Reno says the hospital invested $3.5 million in the machine and built a new suite for it because it allows doctors to tackle the most complex cases.
"Even though we've already hit the best outcomes for stroke in Texas, we're not settling for that. This allows us to do the most difficult patients," he says.
At The Methodist Hospital Research Institute, physicist Christof Karmonik is testing aerodynamics software used to build race cars to try to predict blood flows through potentially deadly aneurysms.
Fluids and air flow in similar ways, Karmonik says. So Methodist is using a program created by Pittsburgh-based Ansys to project the velocity and sheer of blood as it moves toward and through a bulging vessel. The goal: find alternate treatment options based on how fast the blood is traveling and how it reacts when encountering a hard surface, such as the wall of an artery.
''We want to understand how high and low pressure might result in different treatments. We want to understand why, even once aneurysms are closed off, they sometimes grow back," Karmonik says.
"People have started applying this to patient-specific images. It's not an abstract model of the geometry of an aneurysm any more."
Last month, Methodist cardiologist Dr. Miguel Valderrabano began using triangulation similar to that employed by global positioning satellite navigation devices to track heart catheters in his patients suffering from atrial fibrillation, a type of heart arrhythmia that puts people at risk for blood clots.
Instead of using satellites to zero in on the catheter, the Sensei Robotic Catheter uses three magnets to triangulate and locate the catheter, which is fitted with a magnetic tip. The device also measures electrical impedance on three axes.
In the past, physicians had to insert catheters manually and hold them in place while rotating and coercing them up the vessel from the groin to the heart, taking X-rays along the way to track progress.
"It becomes very tricky to know where you are by looking at X-rays," Valderrabano says, adding the near constant radiation is bad for the doctors who do this all day long wearing a heavy lead apron. The new system reduces doctors' and patients' exposure to X-rays.
Valderrabano sits across the room from the patient with an irregular heartbeat. At a computer console with 10 monitors displaying the 3-D body-mapping system, he uses a joystick to drive the catheter to the heart.
The catheter is equipped to measure resistance four times per second as it proceeds so it won't puncture the vessel.
Valderrabano says the technology does not replace judgment or training.
"But this takes the guesswork out of it," he said. "You know what you're doing all the time and it's harder to make mistakes."
Reducing waiting time
The system is part of a "see and treat" movement in medicine that often saves patients from multiple procedures or waiting months to undergo a separate surgery after an initial diagnosis is made.
Stephen Wong, an engineer who is not a physician, chairs medical physics efforts at The Methodist Hospital Research Institute. He says see-and-treat procedures for small-scale lung cancer is coming soon thanks to GPS-like technology.
GPS navigation systems use a preloaded street map and show one variable — the car — moving through it. In Wong's world, a snapshot of the body is the preloaded map and a needle is the car.
Fiber optic wire can be pushed down the needle into the tumor to provide images to the physicians, then a special dye is injected. "If it lights up, it's cancer," Wong says.
With existing methods the process from initial screening to surgery can take three to four months.
But with the method Wong is interested in, an electrical wire could be inserted through the diagnostic needle to burn away the cancer. Tests on animals have been successful, Wong said, adding human subjects won't be far behind.
Wong is also directing a team of researchers that is using pattern recognition software to sift through millions of images of millions of cells in the hopes of finding the origins of cancer.
Wong says it may be possible to predict cancer using the same kind of computer algorithms that help track objects in space.
In theory, the same approach could track treatment, with doctors monitoring a patient's cells to determine if the cancerous ones were dying off or continuing to proliferate.
"This is about early detection and treatment. This is about prevention," Wong says. ''We can apply this to a population of millions or take it down to you — just you. You couldn't think of this even two years ago."
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| ANSYS Technology Offers Swimmers Best Chance of Success in Build-Up to Beijing Games |
Swimmers Wearing Speedo LZR RACER Suit Break 35 World Records, Including 17 of 18 at the FINA World Swimming Championships (25m)
SOUTHPOINTE, Pa., April 22 /PRNewswire-FirstCall/ -- ANSYS, Inc. (Nasdaq: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced that 35 swimming world records have already been broken by athletes wearing a new high-performance swimsuit designed using engineering simulation software from ANSYS. The Speedo(R) LZR RACER(R) suit, developed for elite swimmers and launched in February this year, has been proven in testing to optimize swimmer performance better than any suit to date. Seventeen out of 18 world records were broken at last week's FINA World Swimming Championships (25m) alone, suggesting the Speedo LZR RACER suit will make the headlines at the Beijing games.
Software from ANSYS played a critical role in the development of the suit. The technology was used to predict fluid flows around the body of an elite swimmer in the outstretched glide position (assumed immediately after the initial dive and following each lap's turn off the pool wall) to identify areas where drag, and its slowing effect, is likely to occur. In addition, the simulation analysis guided placement of specially designed drag-reducing Speedo LZR RACER panels to minimize this negative effect. Simulations then were run to confirm the Speedo LZR RACER suit was effective in reducing drag and enabling athletes wearing the suit to swim faster than ever before.
"While never forgetting the endless dedication and spirit of world-class athletes who continually hit new heights, we are thrilled with the success to date of the Speedo LZR RACER suit. This is clear evidence of the power of applying advanced engineering simulation technology to optimize all of the design metrics of a product. The groundbreaking innovation represented by the design of the Speedo LZR RACER suit could not have been achieved without the depth and breadth of technology from ANSYS," said Jim Cashman, president and CEO of ANSYS, Inc. "From the ANSYS perspective, we're finding that there really are no barriers to the potential applications and industries in which our software can be crucial to competitive advantage."
"Speedo is a world-class brand dedicated to continual innovation and working with the best, which makes ANSYS a perfect partner for us. The use of ANSYS software was an integral part of our design and development process, which, alongside with our other key partners, resulted in the development of the world's fastest swimsuit, the Speedo LZR RACER," said Jason Rance, head of Speedo's Aqualab research and development group.
ANSYS worked with Dr. Herve Morvan of Nottingham University and Optimal Solutions in conducting the computational fluid dynamics (CFD) research used to develop the Speedo LZR RACER suit. Speedo has long been recognized as the world's leading swimwear brand.
About Speedo
Synonymous with swimwear, the iconic brand celebrates 80 years of dominance creating revolutionary new technologies, designs and innovations. In the 1920s Speedo(R) made history with the Racerback: the world's first non-wool suit. In 2008 Speedo redefines swimwear again with Fastskin(R) LZR RACER(R) -- the fastest and most technologically advanced swimsuit ever created; meanwhile designer collaborations with Comme des Garcons put Speedo at the cutting edge of design. As the world's leading swimwear brand, Speedo is passionate about life in and around the water, supporting swimming from beginners through to elite level, including the phenomenal Michael Phelps. Speedo is owned by Pentland Brands and distributed in over 170 countries around the world; to find out more visit: www.speedo.com. SPEEDO, the ARROW device, LZR PULSE and LZR RACER are registered trade marks of Speedo Holdings B.V. The LZR RACER suit has worldwide design rights and patents pending.
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| ANSYS Ranked 5th on CIOZone List of 40 Fastest-Growing Big Software Companies |
SOUTHPOINTE, Pa., April 28 /PRNewswire-FirstCall/ -- ANSYS, Inc. (Nasdaq: ANSS), a global innovator of simulation software and technologies designed to optimize product development processes, today announced that it has been ranked fifth on the CIOZone(TM) list of 40 Fastest-Growing Big Software Vendors. Part of its Surging 60 compilation, the listing provides ready information for chief information officers to use in making IT business decisions. ANSYS was one of only two engineering simulation software companies that made the list of 40 Fastest-Growing Big Software Vendors.
According to the CIOZone analysis, the revenue of public U.S. software companies jumped 24 percent in 2007, compared to 2006, while the ANSYS sales growth in that same period was 45.8 percent and the Company's profit change from 2006 to 2007 was 485.7 percent.
CIOZone compiled its Fastest-Growing Big Software Vendors list based on 2007 revenue and profit of publicly held software companies in the United States. It identified Security Industry Codes relevant to software, eliminated companies that were not purely software-related, and limited the list to companies that started the year with more than $150 million in sales "to make sure the list wasn't skewed toward very small companies that most CIOs would be unlikely to find themselves doing business with," the report said. Finally, the listing compared sales growth, revenue, net profit and profit change in calendar year 2007.
"Being listed on the CIOZone software list is an honor," said Jim Cashman, president and CEO of ANSYS, Inc. "It exemplifies our investment in driving technology to new levels, which is being rewarded by strong customer adoption. Many years ago, we saw simulation as the key to predicting how products in development would behave in a real-world environment. We remain committed to invest in the future of our advanced simulation solutions and to further expand our integrated portfolio, which continues to fuel our growth across various diverse industries and geographies."
The Surging 60 also included a list of the 20 Fastest-Growing Small Software Vendors, which consisted of companies that began the year with between $50 and $150 million in revenue. On March 31, 2008, ANSYS announced the proposed acquisition and signing of a definitive agreement for the purchase of Ansoft Corporation, which was named to CIOZone's small vendors' list.
About CIOZone
CIOZone (http://www.ciozone.com) is the original ProSocial(TM) Network for IT Leadership. It is an online, interactive meeting place for high-level chief information officers and IT professionals in which open discussions can freely take place and members are encouraged to share experiential learning with their peers. CIOZone melds expert content, industry information, research and analysis together with user-generated content inside a community, brought and held together through the stewardship of trusted content providers. CIOZone is a Professional Social Networks, Inc.(TM) company. (http://www.professionalsocialnetworks.com).
Professional Social Networks Inc., the Professional Social Networks Inc. logo, CIOZone, the CIOZone logo and ProSocial are registered trademarks of Professional Social Networks, Inc. All other trademarks are the property of their respective owners.
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| Events |
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| European Built Environment CAE Conference (EBECC) |
Date of Event: 5 & 6 June 2008
Location: Haberdashers Hall, London
The European Built Environment CAE Conference (EBECC) is unique. It brings together the Built Environment CAE Community across Europe to one central location. The focal points of the conference are leading-edge simulation software presentations and best practice sessions. In addition, a complementary Partner Pavilion as well as other networking and social events provide a valuable and exciting experience.
Who should attend?
The conference will appeal to anyone involved in the Built Environment industry, from consultants and engineers to senior executives.
Why should you attend?
- Hear about current practice and lessons learned.
- Learn how to deliver innovative engineering solutions by integrating and using simulation software in your analysis and design environment.
- Hear leading keynote speakers outline the latest technology advances in the built environment arena.
- Hear best practices from application experts as they explain how to best apply simulation software to your applications.
- Connect with the latest innovations in the software and hardware Partner Pavilion.
- Network on this international stage with your peers from all across Europe.
Learn more about the use of CAE in:
| Occupant Comfort |
Fire & Safety |
Specialist Design Considerations |
- Offices
- Atria
- Public buildings
- Underground trains and stations
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- Fire modelling
- Smoke transport
- Fire suppressions
- Structural resilience
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- Seismic response
- Cyclic loading on structures
- Cooling of data centres
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Homeland Security |
Wind Engineering |
HVAC, Refrigeration Equipment |
- Explosion modelling
- Chemical and biological gas transport
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- Pressure mapping
- Pedestrian comfort
- Structural loading
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- Fans
- Chilled beams
- Thermal mass devices
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| .... and more |
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| ANSYS UK Regional Conference 2008 |
Get Inspired...
...at the 2008 ANSYS UK Conference
ANSYS believes simulation leads to inspired engineering. We see evidence of this every day as we engage with our customers around the world. Join us at the 2008 UK ANSYS Conference on 29 & 30 October at the Barceló Hotel, Oxford and see for yourself how ANSYS is enabling a whole new level of inspired engineering.
At this conference —one of a series of ANSYS conferences occurring worldwide in 2008 — designers, engineers, analysts and managers will discover:
- How ANSYS solutions enable customers to implement true Simulation Driven Product Development
- How innovative global companies are using simulation to inspire their engineering designs resulting in improved products and processes
- New ideas and experiential insight from ANSYS team members and industry experts
This exciting, informative gathering of the UK’s largest simulation community will feature numerous opportunities for exchanging ideas and improving your engineering simulation skills. Highlights include:
- Keynote presentations from ANSYS management and industry-leading, innovative companies
- User presentations showcasing the unique ways in which customers are using solutions from ANSYS to solve challenging problems
- Product updates
- Technology demonstrations
- Opportunities to meet with ANSYS partners and discuss how their solutions can improve your product development processes
- Training courses (October 28)
- Networking opportunities
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| ANSYS Webinar |
Simulation Driven Product Design and Process Improvement in the Plastic Packaging Industry
Date of Event: Tuesday, June 3, 2008 at 2:00 pm ET
Learn how technology from ANSYS can help you predict package performance before your processes are implemented, and how Simulation Driven Product Development leads to cost savings, reduced time to market and an increased competitive advantage against those that heavily rely on physical prototypes.
Whether it is a blow molded bottle, a thermoformed cup or a clamshell package, engineers need to ensure the structural integrity and behavior of their products while maximizing production rate, minimizing waste and moving products to market quickly.
Coupling the two steps of process design and part design virtually and seamlessly through simulation has so far been more of a wish than a reality. This Simulation Driven Product Development is now possible and the current presentation will show how through concrete examples and a case study highlighting a thermoformed medical tray designed to withstand top load.
Presenter: Hossam Metwally, Ph.D.
Dr. Metwally began working at Fluent Inc. in June 2001 and has continued with ANSYS, Inc. since its acquisition of Fluent in March 2006. He has been involved in multiple consulting projects using computer simulation in different areas of polymers processing including extrusion, thermoforming and blow molding.
Dr. Metwally is a regular attendee and presenter at the ANTEC (Annual Technical Conference for Polymer Science and Polymer Processing sponsored by the Society of Plastics Engineers) and other polymer processing meetings. He was awarded the best paper award from the extrusion division at the ANTEC conference in 2006.
Register for the plastic packaging industry webinar on Tuesday, June 3, 2008 at 2:00 pm ET |
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| Software Products |
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| FloWizard®: Rapid Flow Modeling for Design |
FloWizard® is a highly automated flow modeling tool that allows design and process engineers to rapidly and accurately validate their designs much earlier in the product development cycle. Using FloWizard to rapidly analyze your fluid flow and heat transfer problems throughout development can save you time, money and improve the performance of your designs. FloWizard's Windows look-and-feel user interface is designed for ease of use and high productivity and can be customized to meet your needs.
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| Articles |
| Pipeline & Gas Technology |
| Calculating Dent Strain |
The strain level in a deformed pipe wall has been included in recent years in the assessment of severity of dents in order to better prioritize and effectively repair mechanical damage in pipelines. High-resolution caliper data provide accurate dent shape that can be used for determination of strains using commercial Finite Element Method (FEM) programs.
However, these FEM programs are designed to solve a variety of general problems, and are considered by the authors to be inefficient in calculation of strains in a pipe wall with known radial displacements The goal here is to present a very efficient method that combines analytical techniques with FEM approach. After properly filtering the caliper measurements, the bending strain is calculated from the pipewall curvature, and the membrane strain is obtained using an FEM shell model that includes nodes with only two degrees of freedom in the mid-plane of the wall.
It has been long known that the depth of a dent is not the only factor determining its susceptibility to failure. Therefore, other characteristics of dents have been included in their assessment, such as presence of mechanical damage (cracks, gouges), metal loss, proximity to welds, and location on the pipe circumference (dents on top of the pipe have higher probability of mechanical damage caused by excavation equipment). Since 1998, there have been those who have proposed to also include the strain level as one of the important criteria in assessment of dent severity.1,2 This concept has been incorporated in the 2003 Edition of ASME B31.8 code for Gas Transmission and Distribution Piping Systems3 that imposes a 6% limit on the effective strain induced by dent. However, implementing this criterion has its drawback; it precludes the ability to provide efficient and accurate methods for the determination of those strains, as well as proper filtering of the caliper data that contains a significant level of inherent noise. It is the authors’ opinion that the formula for the effective strain calculation provided in ASME B31.8 significantly underestimates real strain level and should be reviewed.
The strain in a pipewall has two main components: longitudinal and circumferential. Each of them can be further separated into a bending and membrane strains. The membrane strain is constant through the wall, while the bending component changes linearly from the inner to outer surface. The main difficulty is in the determination of membrane strains, while the calculation of bending component is fairly straightforward after properly filtering out the high level of noise in the measured curvature of the pipe wall deformation. The maximum bending strain occurs on the pipewall surface and is simply proportional to the wall thickness and curvature of the dent. The curvature in both axial and circumferential directions is calculated directly from the measured dent shape. The method presented in Reference No. 4 employed 4th order B-splines for calculation of curvature of dents simulated by FEM. It was concluded that high-resolution caliper tools with circumferential spacing not exceeding one inch are required to obtain accurate circumferential bending strain in NPS12 pipe (Figure 1).
The radial displacements obtained from in-line caliper tools are usually affected by the measurement errors, as well as pipe wall surface irregularity that must be eliminated before using them in the calculation of strains. Due to a small sampling distance in high-resolution tools, even small errors in radial measurements introduce large curvature errors. Therefore, filtering of the caliper data is absolutely necessary for accurate calculation of bending strain. It also produces more realistic dent shape that helps to obtain more accurate membrane strains, although they are not as susceptible to the noise as the bending strains. The filtering algorithm employed in this work uses splines available in MATLAB6 in such a way that as much noise as possible is removed from the curvature data while imposing a condition that the deviation of the filtered results from the raw data doesn’t exceed a specified threshold corresponding to 3 standard deviations of the caliper measurement error (typically 1-2mm).
As far as calculation of membrane strains is concerned the existing techniques are limited to the longitudinal strain. The membrane circumferential and shear strains are neglected, although the FEM analysis of actual dents shows that those components may have a similar magnitude to the longitudinal strain. In addition, the current methods offered for calculation of the longitudinal strain are quite simplistic in their approach to calculation. Therefore, the authors suggest that in light of their findings, existing methods should be reviewed and reconsidered7.
At present, the strains in the dented region can be obtained with sufficient accuracy using only Finite Element commercial software. However, those programs, designed to solve a variety of general problems, are very inefficient in solving a particular problem of calculation of a strains in a pipe with known radial displacements. The determination of correct values of strains requires the solution of a large deformation, plastic shell problem with a fairly large number of nodes, each with five degrees of freedom. The solution of this non-linear problem can only be achieved by means of iterations, which is time consuming, and sometimes encounters problems with convergence.
The objective of the present work is to provide a fairly simple but accurate tool for estimation of membrane strains in the dented region. The results of the developed method are compared with the results obtained from commercial Finite Element software (ANSYS) for the nonlinear elastic-plastic material and large deformation model. Fundamental equations The geometry of a dent is provided by an in-line caliper tool, which measures the pipe wall deflection w in the radial direction along the normal axis Z, as shown in Figure 2. The longitudinal ebx and circumferential eby bending strain components can be calculated directly from the curvature of the radial displacement w in the axial x and circumferential y directions, correspondingly:
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| Sitting-acquired deep tissue injuries |
Sitting-acquired deep tissue injuries (SADTI) are the most serious type of pressure ulcers. In order to investigate the ethiology of SADTI a new approach is under development. A musculo- skeletal model can predict forces at different seated positions and thereby find an optimum position where the risk of SADTI is minimized.
This PhD study performed by Christian Gammelgaard Olesen at Aalborg University (sponsored by RBM A/S, a Danish furniture company) focuses on validation of a musculo- skeletal model developed in the AnyBody Modeling System for predicting reaction forces on a wheelchair. A Wheelchair with force- measuring equipment has been developed, a pilot experiment has been conducted, and the experimental results were compared with the predictions of the computational model.
The preliminary results show that the model predicts changes in reaction forces due to changes in the chair posture well. It is concluded that the experimental approach is satisfactory and more experiments is now being carried out to completely validate the computational model. |
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| Flipping the Switch on Electric Car Design |
3D CAD and simulation software are helping electric vehicle teams address new aerodynamics, packaging and power design challenges
Designing a vehicle, whether a sports car or SUV, generally involves a core set of engineering challenges. There are issues around how to achieve great styling that appeals to the target audience along with complexities associated with optimizing performance — and zillions of others in between. Swap out the internal combustion engine for electric power and the hurdles multiply. The engineering team has to contend with the traditional set of design objectives along with new challenges in the areas of aerodynamics, packaging and power.
Part of what makes electric vehicle design more difficult is the fact it’s relatively virgin territory, with many of the core components like battery technology, power train modules and motors still evolving. “The biggest issue with electric vehicle design has to do with the level of maturity of components available,” says Andrew Farah, vehicle chief engineer on General Motor’s Chevy Volt concept electric vehicle. “There is no high volume yet for things like batteries and motors, which makes it a very unique issue for packaging all of this and getting it integrated physically into the vehicle while still maintaining the desired exterior and interior appearance.”
Just as with traditional vehicle design programs, 3-D technologies like CAD and simulation software are playing a huge role in helping large OEMs like GM and boutique electric carmakers tackle some of these challenges. Specifically, 3-D CAD tools enable the construction of full digital mock-ups of the vehicle, allowing manufacturers to modify and manipulate components for optimal packaging far before they build a physical prototype, which is costly to modify. Computer-aided engineering (CAE) software, including finite element analysis (FEA) and computational fluid dynamics (CFD) are also enlisted to fine-tune the aerodynamic nature of the vehicles and to analyze the various structures for optimal weight and materials makeup.
Aerodynamics, in particular, plays a much greater role in electric vehicle design than it does with a traditional gasoline-powered car. Because the power in an electric vehicle is derived from the batteries onboard, there is a constant trade-off between adding more horsepower (i.e., more batteries) and the toll that additional weight will take on the vehicle’s range and maximum speed.
“The impact of the duration you can run the electric-powered vehicle or the range you have is much more critical than the mileage you get out of a gasoline-powered vehicle,” says Peter Schmitt, vice president of sales, automotive business transformation at Dassault Systèmes. “It’s the key inhibitor today for embracing electric vehicles — the battery technology is not at a point where people feel confident.”
CAE analysis also plays a role in the structural analysis of these vehicles, helping companies model components in such a way that minimizes their size and weight, yet doesn’t compromise the integrity of the vehicle. This is particularly important because many of these electric vehicles are toting around hundreds, even over a thousand pounds of battery weight. “Weight is the enemy of efficiency,” says Dave Taylor, senior director worldwide automotive marketing for Siemens PLM Software, a maker of CAE and CAD software. “In a gas-powered vehicle, you’re working to get the most miles per gallon. In a battery-powered vehicle, you want the most distance between charges and every ounce works against you.”
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| Thermal Modeling Approaches Of GaAs Semiconductors |
Introduction
Predicting gallium arsenide (GaAs) semiconductor temperature is imperative since it affects the performance and reliability of the chip and the design as a whole. In many circumstances, the thermal engineer will be asked to provide expeditious and accurate answers to trade studies regarding various FET layouts and geometry, metallization schemes, and conduction paths from the chip down to the heat sink at multiple pulse widths, duty cycles, and power dissipations. The interaction of these parameters affects the thermal performance of a design and necessitates that the engineer have a fundamental understanding of material properties, steady state, and transient responses of each configuration [1].
Despite a full grasp of the above factors, the engineer must also employ tactics that overcome computer processing limitations and the fact that the geometry scale to be thermally resolved at the FET, compared to stackup layers towards the heat sink, can vary by as much as five orders of magnitude. Capturing all these effects in a temperature prediction can be a daunting task. This work discusses a modeling technique and scheme to predict the junction temperature of a GaAs chip efficiently and accurately by means of commercial finite difference thermal modeling software [2].
Problem Description
On a GaAs chip, heat is generated at discrete locations called gates or fingers. The heating is due to the electrical resistance faced by current as it traverses from source to drain circuitry, with the heat generation slightly favoring the drain side. Figure 1 depicts heat generation within a GaAs semiconductor. For the purposes of the modeling results presented, heat generation is assumed to be directly under the gate metal.
Groups of source, drain, and gate metal that are aligned in parallel and tied together electrically are called FETs and groups of FETs are called cells [3]. Although finger length and pitch are shown in Figure 1, finger width is into the page. Typically, a GaAs chip consists of multiple cells positioned on top of the GaAs chip to achieve a desired electrical output. In a typical stackup, the heat conduction path from the chip to the heat sink is as follows: chip > solder > tab > epoxy > metal baseplate > thermal interface material (TIM) > heat sink.
Modeling Techniques
The first step to perform a thermal analysis on a chip with the stackup previously mentioned is to generate a cell-level model whereby the heat generated by the gates is uniformly distributed over the cell area. The problem at hand is a fully 3-D conduction heat transfer problem and the mesh generation needs to take this into consideration. A good practice is to use a high mesh density close to the heat generation sources and relax the mesh further from them. This is shown in the image on the right.
The intent here is to provide an efficient model that resolves temperature gradients below the chip during a pulsed condition and to determine how far the peak power propagates into the stackup during the pulsed condition. The general solution technique is to first solve the model steady state with average power applied uniformly over the cells. By running the pulsed model from the initial conditions established for the steady state model with average power, the peak temperature and transient gradients are established within three periods. The temperature gradients established from the solution of this model remove initial transients that would be seen if the pulsed model was started with the stackup at a uniform temperature, thereby reducing computing time. Temperature gradients through the GaAs, especially near the gates, are not intended to be resolved with this model.
Depending on the length of the pulse width and heat storage capabilities of the stackup materials, temperature gradients at the top of the stackup will be affected by peak power while temperature gradients toward the bottom of the stackup will be affected only by average power. Average power is determined by multiplying the duty cycle by the peak power. A long pulse width will increase the temperature gradient in the top layers of the stackup as these layers "see" peak power for a longer time compared to a short pulse. A large duty cycle will increase the temperature gradient in layers that "see" only average power. For the purposes of this article, a pulse width less than 1ms is considered a short pulse and a pulse width greater than 1ms is considered a long pulse. Figure 3 shows an example of pulse propagation into a typical stackup.
In the case of Figure 3, the pulse propagates into the solder, which results in the chip and solder being affected by peak power. The tab, epoxy, baseplate, TIM, and heat sink are governed by average power dissipation. Figure 3 is typical of the short pulse width condition (< 1ms pulse width) while long pulse widths typically yield peak power down to the epoxy level.
Once the transient analysis of the cell-level model has been completed, resolving the temperature gradient through the GaAs must be performed. The cells are composed of FETs that contain multiple fingers. One cell may contain less than 10 fingers or could contain more than 100 fingers. Since the thermal engineer's goal is to determine peak junction temperature at the end of a pulse, modeling only one fourth of a finger provides an expeditious and conservative means to obtain it [4]. This method employs mirror symmetry about the axis along the pitch of the fingers, and the fact that, for fingers in the middle of a cell, heat transfer only occurs through the GaAs and along the width of the finger. This conduction path is a consequence of the fact that there are adiabatic walls half the distance of the pitch on either side of the finger width. The extension of the resultant one quarter model along the finger width depends on how close another cell is to the one being modeled or if the model becomes limited by the chip periphery. Figure 4 shows an example of a finger-level model.
Typically, temperature gradients along the finger width (y-direction) are negligible compared to those in the first few microns underneath the finger. Therefore, the node-to-node distance along the width of the finger (y direction) versus directly below the finger (z-direction) can be 2-3 orders of magnitude greater. Although the model shown in Figure 4 contains source metallization, the drain metallization, air bridges, and vias through the GaAs are not included. Adding these features can double or triple the model construction time and represent a secondary heat path that can reduce the temperature rise in the GaAs by 10-20% [4]. Their omission will lead to conservative predictions of junction temperature and expedite the generation of results, especially when numerous analyses are required.
The boundary condition for the finger model shown in Figure 4 depends on how far the pulse width propagates into the stackup. Using the example shown in Figure 3, a boundary condition of 41°C would be applied to the bottom of the metal tab in the finger model shown in Figure 4. Using the boundary condition, pulse width, duty cycle, and power dissipation information, a finger-level transient analysis can be performed to obtain the peak junction temperature of the chip with the finger level geometry resolved. An example of a finger level transient is shown in Figure 5.
If a finger level analysis of a long pulse is required, especially a case where the pulse width far exceeds 1ms, a steady state analysis using peak power will yield accurate results. Pulse widths beyond 1ms are typically long enough to allow the GaAs to reach steady state (> 3 time constants). Therefore, a finger model including only the GaAs and the solder layer with the boundary condition applied at the bottom of the solder is sufficient to predict the peak junction temperature. If the pulse width is approximately 1ms, the thermal time constant can be calculated by multiplying the thermal resistance by the specific heat of the GaAs and the solder to confirm if the steady state finger level analysis is valid [5].
Although the modeling techniques mentioned previously assume the validity of Fourier's Law at the cell and finger level, classical heat transport theory begins to breakdown at a length of 0.3 microns. If more detail is desired at the finger level less than 0.3 microns, recent work has provided a means to quantify heat transfer in this regime [6].
Conclusions
Thermal modeling of GaAs semiconductors using the aforementioned techniques provides a conservative and expeditious approach to generating multiple results, which can be used by both mechanical and electrical designers in evaluating design and product performance. If increased accuracy is desired, such as capturing the effects of all the chip metallization and vias, more foresight in model construction must be employed to keep the minimum time step of the thermal model at a reasonable value for the pulse width being analyzed. Although this article's primary focus is predicting chip junction temperature using numerical modeling approaches, analytical methods based on classical heat transport theory still provide valuable insight and comparable accuracy into transient thermal phenomena within a chip. |
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