SIwave™ analyzes entire printed circuit boards (PCBs) and IC packages prevalent in modern electronic products including packages merged onto boards for complete channel analysis. The tool allows engineers to perform complete signal- and power- integrity analyses from DC to beyond 10 Gb/s. SIwave extracts frequency-dependent circuit models of signal nets and power distribution networks directly from electrical CAD layout (E-CAD) databases. These analyses aid in the identification of signal and power integrity problems and are critical to designers seeking first-pass system success. Entire design paths from package to board to package can be analyzed using a full-wave electromagnetic simulator realizing coupling effects between packages and boards that are often ignored. With the IC die network modeler, first order silicon effects can be included in the analyses for a complete channel description. The inclusion of Apache RedHawk™ die models enables analysis of dynamic switching effects.
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New in SIwave v5
- Power Integrity analysis add-on module SIwave PI Advisor
- Integrated SYZ reporter
- Fringing field solver
- Circuit element sensitivity analysis and plotting
- Near-and Far-Field multiprocessing
- Capacitor Library browsing
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