Who is the course for

This course is designed for engineers wishing to understand and use the various coupled field or multiphysics simulation methods available in ANSYS for analysing MEMS devices such as thermal-electric actuators, comb drive resonators, micromirrors, switches and piezeoelectric actuators. You should have a fundamental understanding of multiphysics interactions commonly seen in MEMS devices. You should have already attended the Introduction to ANSYS course or have relevant experience in ANSYS.

Duration:

3 day

Course Aims:

      To Be Able To

• Understand the principles of multiphysics coupling in ANSYS
• Understand the different types of multiphysics coupling schemes available in ANSYS and their suitability for different MEMS applications
• Use the example applications as templates for analysing other MEMS devices

Topics covered

To be able to:

• ANSYS Multiphysics Simulation for MEMS
• ANSYS MultiphysicS
• Multiphysics Simualtion
• Sequential Coupled-Field Simulations
• Direct Coupled-Field Simulations
• Coupled-Field Elements
• ANSYS Multi-Field TM Solver
• Geometric Nonlinearities & Initial Stress
• Contact Analysis
• Current Conduction Analysis
• Thermal-Electric Analyses
• Thermal-Mechanical Analyses
• Electrostatic Analyses
• Open Domains in Electrostatics Analysis
• Capacitance Extraction
• Electrostatic-Structural Coupling
• Sequential Electrostatic-Structural Coupling
• Direct Electrostatic-Structural Coupling using TRANS126
• Pre-stressed Modal Analysis
• Pre-stressed Modal & Pre-stressed Harmonic Analysis Using TRANS126
• Large Signal Time Transient Analysis Using TRANS126
• Reduced Order Macro Modeling for System Level Simulation Using ROM144
• Damping Characterizzation Using Thin Film Elements
• Piezoelectric Analysis
• Thermoelectric Analysis
• Units Systems for MEMS Simulation